Core Technology – DHN
DHN (Digital Holographic Nanoscopy) enables high-speed, label-free 3D profiling at nanometer-level precision using optical interference and digital signal processing.
- One-shot 3D measurement without mechanical scanning
- Robust to vibration – suitable for in-line inspection
- Applicable to transparent materials like glass
- Enables real-time inspection with sub-nanometer resolution
TGV & Glass Substrate Inspection
HICKS DHN systems support advanced inspection for Through-Glass Via (TGV) structures and glass substrates:
- Measurement of CD (Critical Dimensions) from top-waist-bottom
- Defect detection: voids, cracks, copper fill uniformity, misalignment
- Support for wet etching and laser drilling evaluation
- 3D profiling of internal via geometry and defects
Sample Applications
- Smartphone cover glass inspection (dent, scratch, edge crack)
- Transparent films (wrinkles, coating voids, black spots)
- Micro-lens refractive index profiling
- Bio-cell line and axis analysis on transparent substrates
Technology Diagram – DHN Workflow
Light Source → Beam Splitter → Sample & Reference Path → Interference Pattern Acquisition → Digital Image Processing → 3D Surface Depth Output
DHN 기술은 광학 간섭 기반 측정과 후속 디지털 연산을 통해 고속 고정밀 3D 형상 데이터를 생성합니다.
Competitive Advantages
- Faster and more robust than Confocal, AFM, or WSI
- Real 3D measurement without moving parts
- Low sensitivity to vibration and thermal noise
- Supports transparent and reflective inspection targets
Business Impact
By implementing DHN inspection solutions, customers gain:
- Improved yield in TGV and glass interposer fabrication
- Reduced failure rate through early-stage defect detection
- Higher process reliability for advanced packaging and display
- Scalability for mass production with automation readiness